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MAX16929
Automotive TFT-LCD Power Supply with Boost
Converter and Gate Voltage Regulators
ABSOLUTE MAXIMUM RATINGS
INB, ENB to GND ..................................................-0.3V to +42V
BST to GND ...........................................................-0.3V to +47V
BST to LXB ..............................................................-0.3V to +6V
LXB to GND ..............................................................-6V to +42V
AVL, PGOOD to GND .............................................-0.3V to +6V
FBB to GND...........................................................-0.5V to +12V
CP, GH to GND .....................................................-0.3V to +31V
CP, GH to GND (V INA = 3.3V) ..............................-0.3V to +29V
LXP to GND ...........................................................-0.3V to +20V
DRVN to GND........................................................-25V to +0.3V
ENP, DR, FB, GATE, COMPI, FBGH,
FBGL, REF, SEQ to GND .....................-0.3V to (V INA + 0.3V)
GND to PGNDP ....................................................-0.3V to +0.3V
Continuous Power Dissipation (T A = +70 N C)
TSSOP (derate 27mW/ N C above +70 N C)...................2162mW
Operating Temperature Range ........................ -40 N C to +105 N C
Junction Temperature Range........................... -40 N C to +150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
INA, COMPV, FBP to GND ......................................-0.3V to +6V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance ( B JA ) ..........37 N C/W
Junction-to-Case Thermal Resistance ( B JC ) .................2 N C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V INB = 12V, V INA = 5V, V GND = V PGNDP = 0V, T A = T J = -40 N C to +105 N C, typical values are at T A = +25 N C, unless otherwise noted.)
(Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
T Y P
MAX
UNITS
BUCK CONVERTER
V OUTB = 5V (Note 3 )
5.5
28
Supply Voltage Range
V INB
V OUTB = 3.3V (Note 3)
4
28
V
t < 500ms
42
Supply Current
Undervoltage Lockout
I INB
V INB,UVLO
V ENB = 0V
V ENB = V INB , no load, T A = +25 N C
AVL rising
6
70
3.1
9
3.5
F A
V
Undervoltage Lockout Hysteresis
0.5
V
PWM Switching Frequency
Spread-Spectrum Range
f SWB
SSR
5 V , continuous mode
1.9
-3%
2.1
+6
5
2.3
+3%
MHz
%
Output-Voltage Accuracy
V OUTB
6V P V INB P 18V, 5 V , skip mode
I LOAD < full load 3.3V, continuous mode
-3%
-3%
5
3.3
+6%
+3%
V
3.3V, skip mode
-3%
3.3
+6%
High-Side DMOS R DS_ON
Skip-Current Threshold
R DS_ON(LXB) I LXB = 1A
I SKIP
180
16
400
m I
%I MAX
Current-Limit Threshold
I MAX
I OUTB = 1.2A option
I OUTB = 2.0A option
1.6
2.7
2
3.4
2.4
4.08
A
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